PhD Investigation of mechanical stress on MEMS substrates with on-chip MEMS Stress/Strain...

PhD Investigation of mechanical stress on MEMS substrates with on-chip MEMS Stress/Strain sensors (f/m/div.)
Tübinger Straße 123, 72770, Reutlingen, DE
Vollzeit
Unternehmensbeschreibung
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Stellenbeschreibung

• The aim is to create sensors capable of mapping the strain and stress induced on packages by environmental conditions such as temperature changes or physical bending.
• These conditions may arise from processes such as the soldering of the package to the Printed Circuit Board (PCB) or during the temperature cycles of the soldering process.
• The project involves extensive research and development work, including design, simulation, fabrication, and testing of the MEMS strain sensors.

Qualifikationen

• You have a master's degree with excellent grades in a suitable field such as Microsystems, Electrical Engineering, Mechanical Engineering, Physics, Material Science, or a related field
• You have a strong background in MEMS technology and FEM simulations.
• You have experience working with different domains (e.g. simulation, technology and testing).
• Good English communication skills, both written and verbal, are required.

Zusätzliche Informationen
The final PhD topic is subject to your university.
Start: according to prior agreement
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Need support during your application?
Michelle Kurz
+49 7121 35-33122
Need further information about the job?
Rolf Scheben
+49 7121 35-18084